ExpressPrint Label ID Systems |
ExpressPrint T2 ID Labels |
Mark IV Computer Label Systems |
Laundry Indellible Ink Ribbons |
Comfort Tape ID Labels |
Marking Pens |
Heat Seal Machines
Technical Settings for Heat Seal Application
| All Penn emblems may be sewn or heat applied. If you heat apply these emblems, you must be aware of the performance characteristics of your heat seal machines. The proper bonding temperature is 405°F - platen surface. The bonding time will vary depending upon the power of your machines. A machine with a 3" cylinder, 4 x 6 platen and supplied by 80 lbs per sq. in. of air for example, will bond Penn Bond 2000® emblems in 14 seconds. More powerful machines will bond in less time. Please contact your Penn sales representative for specific information on your machines, and ask for your copy of the ABC's of heat sealing.
|
|
This chart will illustrate the proper dwell for the heat seal machinese listed.
SETTINGS FOR HEAT SEALING (AIR PRESSURE ON ALL = 80 PSI)
Penn ColorPrint® Emblems
| (Top Heat Bonding) |
Wizard |
HP4 |
HP8 |
Econ Wiz (c) |
| Top Plate Temp: (Teflon) |
405°F |
405°F |
405°F |
405°F |
| Bottom Plate Temp: (Rubber) |
405°F |
405°F |
405°F |
405°F |
| Dwell Time: (Seconds) |
10 |
14 |
12 |
14 |
Embroidered Emblems
| (Bottom Heat Bonding) (a) |
Wizard |
HP4 |
HP8 |
Econ Wiz (c) |
| Top Plate Temp: (Rubber) |
405°F |
375°F |
405°F |
405°F |
| Bottom Plate Temp: (Teflon) |
405°F |
405°F |
XX (a) |
405°F |
| Dwell Time: (Seconds) |
10 |
14 |
12 |
14 |
PennText® Emblems
| (Top Heat Bonding) |
Wizard |
HP4 |
HP8 |
Econ Wiz (c) |
| Top Plate Temp: (Teflon) |
405°F |
405°F |
405°F |
405°F |
| Bottom Plate Temp: (Rubber) |
405°F |
375°F |
XX (a) |
405°F |
| Dwell Time: (Seconds) |
10 |
14 |
12 |
14 |
PennText® With Merrow Border Emblems
| (Bottom Heat Bonding) (a) |
Wizard |
HP4 |
HP8 |
Econ Wiz (c) |
| Top Plate Temp: (Rubber) |
405°F |
375°F |
405°F |
405°F |
| Bottom Plate Temp: (Teflon) |
405°F |
405°F |
XX (a) |
405°F |
| Dwell Time: (Seconds) |
10 |
14 |
12 |
14 |
Dot Matrix Computer Labels
| (Top Heat Bonding) |
Wizard |
HP4 |
HP8 |
Econ Wiz (c) |
| Top Plate Temp: (Teflon) |
405°F |
405°F |
405°F |
405°F |
| Bottom Plate Temp: (Rubber) |
405°F |
375°F |
XX (a) |
405°F |
| Dwell Time: (Seconds) |
8 |
12 |
10 |
12 |
Mending Materials
| (Top Heat Bonding) (b) |
Wizard |
HP4 |
HP8 |
Econ Wiz (c) |
| Top Plate Temp: (Teflon) |
405°F |
3405°F |
405°F |
405°F |
| Bottom Plate Temp: (Rubber) |
405°F |
375°F |
XX (a) |
405°F |
| Dwell Time: (Seconds) |
8 |
12 |
10 |
12 |
PennBroidery® For Woven Shirts
| (Bottom Heat Bonding) |
Wizard |
HP4 |
HP8 |
Econ Wiz (c) |
| Top Plate Temp: (Rubber) |
405°F |
375°F |
XX (a) |
405°F |
| Bottom Plate Temp: (Teflon) |
405°F |
405°F |
XX (a) |
405°F |
| Dwell Time: (Seconds) |
10 |
14 |
XX (a) |
14 |
PennBroidery® With Knit Shirts*
| (Bottom Heat Bonding) |
Wizard |
HP4 |
HP8 |
Econ Wiz (c) |
| Top Plate Temp: (Rubber) |
405°F |
375°F |
XX (a) |
405°F |
| Bottom Plate Temp: (Teflon) |
405°F |
405°F |
XX (a) |
405°F |
| Dwell Time: (Seconds) |
10 |
14 |
XX (a) |
14 |
(a) HP Press is not recommended for bottom heat bonding. Bottom Platen for HP8 press does not have a heating element.
(b) For Polyurethane based backing only.
(c) Econo Wiz with 4 x 6 platen. Econo Wiz with 2 x 4 platen would have the same specs.
* Note for all knit shirts: We recommend using a small piece of sponge rubber (approximately 1/2" large on all sides than the emblem) as the top platen. When using this method, reduce the air pressure from 80 to 60 psi. Then place the garment on the bottom platen, position the PennBroidery® and place the piece of rubber on top and cycle the machine. This reduces the platen mark on the knit shirt.
The above information is a recommendation only. There are circumstances which may be different. Please check on information not listed above. |
Garment Label System & Heat Seal Machines
Heat Seal Parameters for Classic ExpressPrint